Nanjing Core Vision Microelectronics was invited to attend the Symposium on Silicon-Based Optoelectronic Integration Technology and Applications

6/26/2019
On June 26, 2019, the "2019 Nanjing Innovation Week" officially kicked off. On the same day, the 4th Symposium on Silicon-Based Optoelectronic Integration Technology and Applications, one of the 100 series events of the Innovation Week, was successfully held in Jiangbei New Area, Nanjing.
Hosted by the Talent Exchange Center of the Ministry of Industry and Information Technology and the Administrative Committee of Jiangbei New Area, Nanjing, the event was organized by Jiangbei New Area IC Smart Valley and Jiangbei New Area Industrial Technology Research and Innovation Park.
From cutting-edge technology trends and industrial ecosystems to industrialization applications, the symposium conducted a three-dimensional discussion on the silicon-based optoelectronic industry, covering perspectives from the macro to the micro, and from the "near future" to the "immediate reality". By means of industry-university-research innovation exchanges and project matchmaking sessions, it effectively realized the integration, connection and transformation of resources, adding wings to the innovative development of the silicon-based optoelectronic industry.
As a leading enterprise in the silicon-based optoelectronic field, Nanjing Core Vision Microelectronics Technology Co., Ltd. was invited to participate in this symposium.



At the symposium, Dr. Li Cheng, Founder of Nanjing Core Vision Microelectronics, was invited to serve as the guest host. The participating guests conducted in-depth discussions and delivered themed presentations centering on the silicon-based optoelectronic industry ecosystem, and all expressed strong optimism about the market prospects of the silicon-based optoelectronic industry.


This symposium brought together hundreds of domestic and international experts and practitioners in the silicon-based optoelectronic integrated circuit industry. Centering on diverse themes including chip design, packaging and testing, artificial intelligence, and the Internet of Things (IoT), participants discussed technological advancements, showcased cutting-edge applications, and facilitated project resource matching. In addition, the symposium provided a platform for industry talents to learn, communicate, cooperate, and pursue entrepreneurial opportunities.
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