※ Ultra-low power consumption SPAD Array (60mW) with an advanced 3D stacking structure that drastically reduces the chip footprint, thereby enhancing performance and cutting power consumption to deliver greater value for end users.

※ Equipped with the latest backside-illuminated (BSI) SPAD sensor technology and Deep Trench Isolation (DTI) process, achieving a nearly 7x improvement in detection efficiency compared to traditional Front-Side Illuminated (FSI) technology.

※ Optimized and upgraded Time-of-Flight (ToF) optical detection performance enables real-time ToF recording, effectively mitigating the photon pile-up issue caused by ambient light.

visionICs, a world-leading dToF chip design company, recently announced the launch of its Global Shutter BSI SPAD chip — the all-new stacked dToF depth sensor VA6320. Boasting a compact form factor, this sensor supports 1200-point resolution and a 60fps frame rate, delivering a cost-effective, high-performance solution for photography, AR/VR and other applicable devices.

In recent years, smartphones, AR/VR and other consumer electronic devices have gained immense popularity worldwide. AR/VR, in particular, as the gateway to the metaverse, has experienced explosive growth driven by the rapid development of metaverse technology. As a leader in optical sensing chips, visionICs has developed the all-new stacked dToF depth sensor VA6320 for the mobile and AR/VR sectors to enable higher-performance distance sensing, fueling the rapid advancement of the mobile, AR/VR and related industries.

visionICs VA6320 vs Apple LiDAR Scanner

Ben, Chief Architect of the Chip R&D Department at visionICs, stated:

Unlike the speckle technology of the Apple LiDAR Scanner launched in 2020, the VA6320 adopts a Flash laser illumination solution. Evaluated in terms of cost, form factor and power consumption, the VA6320 outperforms the former by a significant margin and offers better compatibility with a wider range of system integrations. The VA6320 provides precise 1200-point depth information, and when paired with a multi-sensor fusion algorithm, it generates sufficiently dense point clouds to deliver reliable distance sensing for end devices.

All-Round Performance Upgrades

Advanced

※ The VA6320 features an industry-leading 3D stacking structure, integrating the sensor wafer and image processing logic wafer via wafer-level Cu-Cu hybrid bonding. While reducing the chip footprint, it allows for customized process design for the distinct characteristics of the sensor and logic circuit, achieving an overall improvement in both performance and power efficiency.

Innovative

※ Adopting visionICs’ latest BSI SPAD sensor technology and DTI process, it achieves a nearly 7x boost in detection efficiency over traditional FSI technology. It delivers exceptional detection performance in the near-infrared band, reduces optical crosstalk between pixels, and boasts industry-leading Photon Detection Efficiency (PDE).

※ The logic section of the VA6320 integrates innovative designs including a dynamic power management module, high-performance TDC, DSP processing module, and a global shutter architecture. It can complete 1200-point depth detection in a single capture, delivering outstanding performance with high frame rate, short exposure and low power consumption.

Optimized

※ Optimizations to the TDC and logic modules for optical ToF detection enable real-time ToF recording, effectively mitigating the photon pile-up issue caused by ambient light and delivering superior sunlight immunity.

※ On-chip integration of visionICs’ Gen2 DSP depth signal processing module enhances precision and anti-ambient noise capability. Paired with a MIPI interface, it outputs sub-millimeter precision depth point clouds at 60fps, while also supporting histogram output at the original frame rate — providing greater extensibility for backend algorithms.