Core Vision Microelectronics Launches Global Shutter BSI SPAD Chip
6/6/2023
Equipped with the latest back-illuminated BSI SPAD sensor technology and Deep Trench Isolation (DTI) process, it delivers nearly 7× higher detection efficiency compared with the traditional Front-Side Illumination (FSI) technology.
The performance of optical time-of-flight detection is optimized and upgraded, enabling real-time time-of-flight recording and significantly resolving the photon accumulation issue caused by ambient light.
Core Vision Microelectronics, a leading dToF chip design company in the industry, recently announced the launch of the Global Shutter BSI SPAD chip — the all-new stacked dToF depth sensor VA6320. Boasting a compact size, this sensor supports 1200-point resolution and a 60fps frame rate, providing a cost-effective and high-performance solution for devices in applications such as photography and AR/VR.
In recent years, devices such as smartphones and AR/VR products have gained immense popularity in the consumer electronics sector.In particular, AR/VR, regarded as the gateway to the "metaverse", has also entered a phase of rapid development amid the booming growth of the metaverse.
As a leader in optical sensor chips, Core Vision Microelectronics has developed the all-new stacked dToF depth sensor VA6320 tailored for the mobile and AR/VR sectors.This sensor delivers higher-performance distance sensing, empowering the accelerated advancement of industries including mobile and AR/VR.
As a leader in optical sensor chips, Core Vision Microelectronics has developed the all-new stacked dToF depth sensor VA6320 tailored for the mobile and AR/VR sectors.This sensor delivers higher-performance distance sensing, empowering the accelerated advancement of industries including mobile and AR/VR.
