From November 16 to 18, 2022, Core Vision Microelectronics, a leading enterprise in single-photon dToF chip design, was invited to participate in the 4th International LiDAR Advanced Technology Exhibition and Exchange Conference.
Dr. Yu Kunzhi, Co-founder and Chief Technology Officer (CTO) of Core Vision Microelectronics, attended the conference on behalf of the company and delivered a special speech titled SPAD Array SoC Chip Design for Automotive Solid-State LiDAR as a guest speaker.


Safety is the top priority for automotive manufacturers, and products intended for automotive applications must strictly comply with automotive-grade certification standards. For its SPAD dToF chips designed for automotive blind-spot fill solid-state LiDAR products, Core Vision Microelectronics will strictly conduct design and manufacturing in accordance with automotive safety standards and obtain the corresponding certifications.
Dr. Yu Kunzhi, Co-founder and Chief Technology Officer (CTO) of Core Vision Microelectronics, stated in his speech:
LiDAR boasts unique advantages. It enables high-precision HD map creation and positioning, obstacle detection and segmentation, obstacle trajectory prediction, and drivable space detection. As an indispensable core sensor for achieving autonomous driving/advanced driver assistance systems (ADAS), LiDAR plays a vital role in multi-sensor fusion. Based on market demands and leveraging years of R&D experience and mass production delivery expertise in the SPAD technology route, Core Vision Microelectronics has initiated the design of SPAD dToF SoCs for automotive blind-spot fill solid-state LiDAR. The SPAD within this SoC features a designed photon detection efficiency (PDE) of 20% and afterpulsing of < 0.1%, delivering advantages such as high sensitivity, wide dynamic range, high reliability, and simplified system integration. It can facilitate high integration and miniaturization of solid-state LiDAR, while enhancing reliability and service life and reducing costs. Addressing the industry’s primary concern of automotive-grade compliance, the SoC already integrates automotive functional safety modules including eye safety detection and functional failure diagnosis. Going forward, strict adherence to automotive-grade standards and requirements will be enforced throughout the chip tape-out, packaging, and testing processes.
Dr. Yu Kunzhi, Co-founder and CTO of Core Vision Microelectronics, Attends International LiDAR Advanced Technology Exhibition and Exchange Conference
Core Vision Microelectronics has always upheld the business philosophy of “Opening the Window of ‘Vision’ Starting from the ‘Chip’”. It is committed to empowering high-level autonomous driving blind-spot fill applications with reliable and safe “Vision” chips.
Core Vision Microelectronics (visionICs)Founded in 2018, Core Vision Microelectronics Technology Co., Ltd. operates R&D centers in Nanjing and Shanghai, and a marketing center in Shenzhen. A leader in single-photon direct ToF (SPAD ToF) technology and its practical applications, Core Vision Microelectronics is one of the global pioneers in single-photon dToF 3D imaging technology R&D. Leveraging its expertise in chip-level photoelectric conversion device design and single-photon detection imaging technology, the company designs and markets a portfolio of 1D and 3D ToF sensing chips based on single-photon detection. These products are widely applied in diverse consumer electronics fields including robotic vacuums, drones, smartphones, smart glasses, and smart home devices, as well as in autonomous driving LiDAR systems.